Metal-semiconductor resistive ribbon for thermal transfer printing and method for using
US4470714A · kind A · utility
9Cited by
12References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1982 |
| Grant date | Sep 11, 1984 |
| Priority date | — |
| Expiry date | Mar 10, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/914
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of non-stoichiometric metal silicide is disclosed. Also disclosed are appropriate power sources for using the resistive ribbon, as well as methods for non-impact printing employing the disclosed ribbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.