Apparatus for oscillatory bonding
US4470868A · kind A · utility
22Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1982 |
| Grant date | Sep 11, 1984 |
| Priority date | — |
| Expiry date | Apr 23, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1771
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus are disclosed for the bonding together of two similarly shaped articles of similar thermoplastic material utilizing oscillatory motion between the two articles to generate frictional heat therein sufficient to form an hermetic seal therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.