Process for the production of metallized semiconductors

US4472458A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Kirkor Sirinyan · Bensberg, DE
• Rudolf Merten · Leverkusen, DE
• Gerhard D. Wolf · Dormagen, DE
• Henning Giesecke · Cologne, DE
• Uwe Claussen · Leverkusen, DE
• Harold Ebneth · Leverkusen, DE

Key dates

• Filing date: Jan 13, 1983
• Grant date: Sep 18, 1984
• Expiry date: Jan 13, 2003

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31678
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the IB and VIIIB Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallizing without current.