Electroless direct deposition of gold on metallized ceramics
US4474838A · kind A · utility
8Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1982 |
| Grant date | Oct 2, 1984 |
| Priority date | — |
| Expiry date | Dec 1, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/245
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electroless gold plating baths for plating metallized ceramics wherein the bath comprises (a) alkali metal gold cyanide, (b) alkali metal fluoride, and (c) alkali metal hydroxide. The baths may optionally contain a buffering agent and/or ammonium hydroxide and/or an organic chelating agent. The metallized ceramics contain tungsten, molybdenum, electroless nickel, copper and the like. The gold constituent in the alkali metal gold cyanide may be monovalent, trivalent or mixtures thereof. The method of utilizing such electroless or autocatalytic plating baths is also described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.