Stencil apparatus
US4475477A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1982 |
| Grant date | Oct 9, 1984 |
| Priority date | — |
| Expiry date | Dec 27, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/50
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A powder deposition apparatus comprising a stencil means having an upper non-permeable surface, with a cut-out therethrough is adapted on top of a screen, and a lowermost foil surface with a similar aligned cut-out therethrough which apparatus is articulatable over a receiving surface. The apparatus also comprises a gasket which is secured to the lowermost foil side of the screen, around at least a portion of the cut-out. The gasket may be of uniform thickness along its entire length or of tapering thickness at its end portions. The deposition apparatus permits a configuration of powder to be applied to the receiving surface in a three-dimensional configuration, the gasket acting as a retaining partition and a spacing means, to provide a desired configuration (height/taper, breadth, and width) of a product, for subsequent application after proper heating and fusing, to a substrate, preferably to the inner side of a shoe upper to which the fused powder would adhere and act as a reinforcement or decorative member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.