Method and device for attaching disc-or plate-shaped target bodies to cooling plates for sputtering systems
US4476151A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1983 |
| Grant date | Oct 9, 1984 |
| Priority date | — |
| Expiry date | Aug 24, 2003 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2035/008
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A target body composed of a select target material is attached to a cooling plate for sputtering systems in such a manner that substantially no bubbles, pores or oxide layers are present in the ultimate solder joint between the surfaces joined together. A pre-soldered target body and a corresponding presoldered cooling plate are exposed, in a vacuum, to a temperature above the melting point of the solder utilized so that degasification of the liquified solder occurs and any oxide layers present are decomposed and purged from the solder. Upon cooling in vacuum, the solder resolidifies and excludes any air bubbles, pores or oxide layers. A frame body with a two-step recess, with a lower recess or opening snugly fitting about a cooling plate and an upper opening freely fitting about the solder joint can be used to practice this technique. A subsequent reflow soldering can likewise occur in vacuum at a temperature above the melting point of the solder utilized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.