Low temperature deposition of nickel films
US4478890A · kind A · utility
0Cited by
3References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1983 |
| Grant date | Oct 23, 1984 |
| Priority date | — |
| Expiry date | Sep 12, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A low-temperature, electroless process for the plating of nickel metal upon substrate. Nickel, olefin, and trifluorophosphine vapors are condensed and reacted in a vessel. The reaction product is distilled off and condensed onto the surface of a substrate. The surface is warmed and the reaction product allowed to decompose, yielding a coating of nickel metal upon the substrate, gaseous olefin and Ni(PF.sub.3).sub.4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.