Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board
US4479298A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 1983 |
| Grant date | Oct 30, 1984 |
| Priority date | — |
| Expiry date | Jul 26, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for aligning the leads of an integrated circuit (IC) package with respect to the pads of the printed circuit board to which they will be bonded is presented. An alignment fixture, comprising a coarse alignment pedestal mounted on a fine alignment block, receives the IC package on the alignment fixture and aligns the leads with respect to a reference coordinate system of the alignment fixture. A vacuum chuck is lowered to contact the aligned package, and is then raised to lift the aligned package off the fine alignment block while holding it in the aligned position. An X-Y table positions the printed circuit board under the aligned package. The vacuum chuck lowers the aligned package until the leads contact the pads, and holds it while the leads are bonded to the pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.