Method for determination of concentration of organic additive in plating bath
US4479852A · kind A · utility
30Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1983 |
| Grant date | Oct 30, 1984 |
| Priority date | — |
| Expiry date | Jan 21, 2003 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/4161
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.