Epoxy resin fortifiers based on aromatic amides
US4480082A · kind A · utility
73Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1983 |
| Grant date | Oct 30, 1984 |
| Priority date | — |
| Expiry date | Jul 25, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/44
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The reaction product of (i) an aromatic amide having the amine group of the amide attached to an aromatic ring, and (ii) a mono- or di-epoxide, has been found to be a good fortifier of epoxy resins. Epoxy resins have been found to attain increased strength and modulus (yet not brittle) by compounding: PA1 (a) a resin-forming polyepoxide, PA1 (b) an amine curing agent for (a), and PA1 (c) the above fortifier; and heat curing the mixture. Strengths as high as 130-150 MPa and modulus values to as high as 5000 MPa have been achieved yet with a ductile mode of fracture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.