Blister-resistant dielectric
US4481261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1982 |
| Grant date | Nov 6, 1984 |
| Priority date | — |
| Expiry date | Dec 1, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A blister-resistant thick film dielectric is usable with multilayer circuits having one conductor layer comprising gold and another conductor layer comprising silver to prevent blistering and other unwanted phenomena resulting from an adverse electrochemical reaction from occurring between the conductor layers during the firing process. The dielectric is comprised be weight, without vehicle, of about 50% lead-boro-silicate glass, between about 25% to about 40% Al.sub.2 O.sub.3 and between about 10% to 25% an oxide mixture comprised of Co.sub.2 O.sub.3, Cr.sub.2 O.sub.3 Fe.sub.2 O.sub.3, said oxide mixture having been heated to about 1000.degree. C. for about 24 hours. In a preferred embodiment the dielectric is comprised by weight, without vehicle, of about 50% lead-boro-silicate, about 40% Al.sub.2 O.sub.3 and about 10% oxide mixture. The oxide mixture in a preferred embodiment is comprised by weight of about 37.4% Co.sub.2 O.sub.3, about 25.6% Cr.sub.2 O.sub.3 and about 37.0% Fe.sub.2 O.sub.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.