Method of treating direct positive silver halide sensitive material
US4481285A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1983 |
| Grant date | Nov 6, 1984 |
| Priority date | — |
| Expiry date | Apr 14, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/141
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of treating a direct positive silver halide sensitive material is disclosed. The material is comprised of a base having thereon a compound represented by the general formula (I), a sensitive silver halide photographic emulsion layer and a hydrophilic colloid layer. The exposed material is developed in the presence of the compound represented by the general formula (II) ##STR1## wherein R.sup.1 and R.sup.2 independently represent a hydrogen atom, an aliphatic residue, an aromatic residue or a heterocyclic residue, R.sup.3 represents a hydrogen atom or an aliphatic residue, R.sup.4 represents a hydrogen atom, an aliphatic residue or an aromatic residue, and X represents a divalent aromatic residue; ##STR2## wherein R.sup.1 and R.sup.2 represent each a hydrogen atom or an aliphatic residue, and R.sup.1 and R.sup.2 may form a ring by linking together, R.sup.3 represents a divalent aliphatic residue, X represents a single bond or a divalent heterocyclic ring containing nitrogen, oxygen or sulfur atoms, and M represents a hydrogen atom, an alkali metal, an alkaline earth metal, a quaternary ammonium salt, a quaternary phosphonium salt or an amidino group. The invention provides …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.