Bonding method for producing very thin bond lines
US4482418A · kind A · utility
4Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1983 |
| Grant date | Nov 13, 1984 |
| Priority date | — |
| Expiry date | Aug 17, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A bonding method which uses two solutions, one being anionic and the other being cationic, to lay down alternating layers of particles of accurate dimension onto members which are to be bonded. Thereafter, the layers are placed in contact, and the members are bonded together by diffusion bonding techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.