Electroless alloy plating
US4482596A · kind A · utility
29Cited by
7References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1982 |
| Grant date | Nov 13, 1984 |
| Priority date | — |
| Expiry date | Aug 25, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31707
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure having a catalytic surface plated with an autocatalytic electroless alloy of copper, a metal selected from nickel, cobalt, mixtures thereof and phosphorous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.