Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
US4482665A · kind A · utility
11Cited by
5References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 1982 |
| Grant date | Nov 13, 1984 |
| Priority date | — |
| Expiry date | Sep 14, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Electronic components are encapsulated with a calcium silicate-containing poly(arylene sulfide) composition. The composition can also contain a filler such as talc or silica and an organosilane such as 3-mercaptopropyltrimethoxysilane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.