Semiconductor device soldered to a graphite substrate
US4482913A · kind A · utility
3Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1982 |
| Grant date | Nov 13, 1984 |
| Priority date | — |
| Expiry date | Feb 24, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a semiconductor device in which a wafer of semiconductor material is soldered to a graphite substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.