Board to board interconnect structure
US4482937A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1982 |
| Grant date | Nov 13, 1984 |
| Priority date | — |
| Expiry date | Sep 30, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/73
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A board to board interconnect assembly is installed between a first multilayer circuit board and a second multilayer circuit board. The assembly is comprised of a first housing member carrying electrical contacts and a second housing member carrying electrical contacts which mateably engage with the contacts of the first housing member. The first and second circuit boards have corresponding arrays of plated through apertures selectively connected to the circuit layers of the respective boards. Socket carrying contacts are frictionally engaged in certain of the plated through conductive apertures of the first and second circuit boards to secure the first housing member to the first circuit board and the second housing member to the second circuit board. Flex contacts are installed in conductive plated through apertures of the boards opposite each of the socket contacts and are frictionally engaged with the socket contacts. The socket and flex contacts are frictionally coupled to electrically connect the circuit layers of the first circuit board with the circuit layers of the second circuit board in a direct vertical relationship. The opposed first and second housing members support …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.