Method for directly joining metal pieces to oxide-ceramic substrates
US4483810A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1983 |
| Grant date | Nov 20, 1984 |
| Priority date | — |
| Expiry date | Feb 4, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/38
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for the direct joining of metal pieces which have a surface metal oxide layer, to oxide ceramic substrates by heating the ceramic substrates covered with the metal pieces in an oxygen-containing atmosphere to a temperature above the eutectic temperature of the metal and the metal oxide, but below the melting temperature of the metal. The heating is carried out in a continuous heating furnace in a nitrogen atmosphere with an addition of oxygen of 20 to 50 vpm. The cooling-down in the continuous heating furnace takes place after the solidification of the eutectic melt, in a nitrogen atmosphere which has an oxygen content well below the 20 vpm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.