Method of through-contacting a circuit board
US4485129A · kind A · utility
3Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1983 |
| Grant date | Nov 27, 1984 |
| Priority date | — |
| Expiry date | Jun 23, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0763
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is proposed for through-contacting a circuit board (17), in which the wall (15) of a bore (16) is provided with a metallizing of a conductive thick-film paste (12). The application of the metallizing is effected in a particularly advantageous manner by imprinting the electrically conductive paste (12) by means of an elastically deformable imprinting stamp (11, 12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.