Process and apparatus for applying relatively hard particles to a circular wire-like form or a wire-like form without longitudinal edges, as well as wire-shaped saw
US4485757A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1982 |
| Grant date | Dec 4, 1984 |
| Priority date | — |
| Expiry date | Nov 24, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0054
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and a process are disclosed making it possible to mount, without disadvantages, relatively hard particles, such as diamond dust and the like, on wire-like base material in such a way that the diamond dust is not damaged, wherein any desired coating, that is, especially also a coating coherent over the length of the wire, can be produced. This coating is at least macroscopically homogeneous in character. In such a process for the application of relatively hard particles to a circular wire-like form or a wire-like form without longitudinal edges, for the purpose of producing a plain or multiple saw, the form is coated under pressure with the aid of a surface of two rolls. This surface is at least partially provided with the particles to be applied. The wire-like form is turned about its longitudinal axis during this process. The form must be present in the straight, that is stretched, condition. The process can be performed with an apparatus exhibiting two hardened and ground rolls movable relatively to each other. These rolls serve for the accommodation of hard particles and the form to be coated, and for rolling the form between the two outer surfaces of the rolls. The…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.