Selective plating of dielectric substrates
US4486273A · kind A · utility
4Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1983 |
| Grant date | Dec 4, 1984 |
| Priority date | — |
| Expiry date | Aug 4, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Process for the maskless electroplating of selective areas of a dielectric substrate comprising depositing an electroconductive film on the surface, evaporating a narrow band of the film off the surface to expose a narrow strip of substrate surrounding a zone of the film where electroplating is unwanted, immersing the substrate in an electroplating bath opposite an appropriate anode, and cathodizing only that portion of the film that covers the region sought to be plated. In one embodiment a laser beam is used to selectively evaporate electroless copper from the surface of an ABS substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.