Palladium plating prodedure
US4486274A · kind A · utility
14Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 1983 |
| Grant date | Dec 4, 1984 |
| Priority date | — |
| Expiry date | Mar 21, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.