Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound
US4486583A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1983 |
| Grant date | Dec 4, 1984 |
| Priority date | — |
| Expiry date | Aug 23, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer which has excellent heat resistance and mechanical properties which is useful as a molding material, contains the structural units having the following formulae [I] and [II]: ##STR1## wherein A and B each represents an at least divalent organic group having at least one aromatic ring such as a diphenyl ring; and m and n each represents a number of at least 1. The polymer is used in the form of a solution or varnish as an impregnating, laminating, bonding or film-forming coating or prepreg-forming varnish. A resin composition for forming the polymer contains an aromatic cyanamide compound and an aromatic amine which are reacted to form a prepolymer which, upon heating, is converted into a cured polymer having the structural units of formulae [I] and [II].
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.