Method of fabricating a multi-layer type semiconductor device including crystal growth by spirally directing energy beam
US4487635A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1983 |
| Grant date | Dec 11, 1984 |
| Priority date | — |
| Expiry date | Feb 14, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a superior semiconductor crystallized layer rapidly on a semiconductor substrate with the surface thereof covered with an insulating film is disclosed. An opening, desirably formed by at least two insulating films, is formed at an intersection of scribe lines of the semiconductor substrate. A polycrystal semiconductor film is formed on the insulating films and the opening, after which an energy beam is irradiated spirally on the polycrystal semiconductor film in such a manner that the beam passes at least one opening during each rotation thereof thereby to transform the polycrystal semiconductor film into a crystallized layer for forming a semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.