Powdered mixture of polyamides for heat sealing by the powder point process
US4487895A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1984 |
| Grant date | Dec 11, 1984 |
| Priority date | — |
| Expiry date | Jun 1, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2746
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Powdered polyamide mixtures for use in the heat sealing of textiles by the powder point process. The polyamide homogeneous mixtures contain: (a) about 95 to 40% by weight of at least one copolyamide with a melting point of at least about 110.degree. to 140.degree. C. and having a proportion of a basic lauryllactam monomer component of at least 20% and at most 70% by weight; and (b) about 5 to 60% by weight of at least one copolyamide with a melting point between about 80.degree. to 110.degree. C. and having a proportion of a basic lauryllactam monomer component or lauryllactam and 11-aminoundecanoic acid copolymer of at least 25% and at most 70% by weight, where the percentages are based on the total weight of the copolyamide mixtures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.