Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4489364A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 1981 |
| Grant date | Dec 18, 1984 |
| Priority date | — |
| Expiry date | Dec 31, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip carrying module includes a number of engineering change lines buried below the surface of the module. The engineering change lines are interrupted periodically to provide a set of vias extending up to the upper surface of the module between each set of chips where the vias are connected by dumbbell-shaped pads including a narrow link which permits laser deletion or the like. In addition, the dumbbell-shaped pads are located adjacent to the fan-out pads for the chips. Thus, the fan-out pads can be connected to the dumbbell-shaped pads by means of fly-wires. In addition, individual engineering change lines can be connected together to reach every region of the module by connecting a fly-wire from one dumbbell-shaped pad to another. In addition, by deleting the links at such dumbbell-shaped pads, the engineering change connections are limited to the particular path required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.