Moistureproof insulating coating composition for packing circuit boards
US4490496A · kind A · utility
9Cited by
10References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 28, 1983 |
| Grant date | Dec 25, 1984 |
| Priority date | — |
| Expiry date | Feb 28, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D133/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A coating composition comprising (A) a thermoplastic resin having a glass transition temperature of 0.degree. to 80.degree. C., (B) a compound having 2 or more hydroxyl groups in the molecule, (C) a thixotropic agent and (D) a solvent, and said coating composition having a viscosity of 3 to 50 poises at 25.degree. C. and a thixotropy of 2 or more can give a moistureproof insulating coating film with uniform and large thickness and very few bubbles by one-time treatment over packing circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.