Mounting housing for leadless chip carrier
US4491377A · kind A · utility
Inventor
Key dates
| Filing date | Apr 19, 1982 |
| Grant date | Jan 1, 1985 |
| Priority date | — |
| Expiry date | Apr 19, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1076
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a mounting housing for leadless chip carriers for use on burn-in boards, circuit boards and the like. The housing includes an insulating base support containing a plurality of electrically conductive axially elongated bodies extending therethrough arranged to define a rectangular cavity in a plane parallel with the first major face of the base support. The ends of the axially elongated bodies defining the cavity have edges inclined inwardly toward the cavity and edges inclined outwardly from the cavity. A spreader mounted for reciprocal movement axially with respect the elongated bodies has an inclined surface mating with the outwardly inclined edges of the elongated bodies so that movement of the spreader moves the inwardly inclined edges outwardly to permit insertion of a leadless chip carrier within the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.