Metal-insulator resistive ribbon for thermal transfer printing
US4491431A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1982 |
| Grant date | Jan 1, 1985 |
| Priority date | — |
| Expiry date | Dec 30, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/914
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A resistive ribbon printing technique is described in which the ribbon includes a resistive layer comprised of a metal-wide bandgap insulator combination. The ribbon also includes a support layer, where the support function can be provided by the resistive layer, and a fusible ink layer. Electrical current through the resistive layer produces heat which locally melts the ink for transfer to an adjacent receiving medium. The wide bandgap insulator of the resistive layer must have a bandgap of at least three volts. Many different metals and insulators can be used, where the relative amounts of metal and insulator are chosen to provide a desired resistivity for any type of resistive ribbon printing application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.