Process for plating a long span of metal with a metal layer
US4492615A · kind A · utility
4Cited by
6References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 1983 |
| Grant date | Jan 8, 1985 |
| Priority date | — |
| Expiry date | Apr 18, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/0614
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for the continuous, electrolytic plating of a long span of metal with a layer of metal, having a high line speed and low period of immersion in the electrolyte, and a device therefor. The span of metal is passed through a shaving drawplate, then through a metal plating solution to which an electric voltage is applied through a fluid electric connector comprising a solution of metal chloride, a fluoride and boric acid. The process is used to plate a metal with an adhesive metal layer, which provides both ductility to facilitate extrusion and low, non-evolving contact resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.