Process for activating substrate surfaces for currentless metallization

US4493861A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Kirkor Sirinyan · Bensberg, DE
• Henning Giesecke · Cologne, DE
• Gerhard D. Wolf · Dormagen, DE
• Harold Ebneth · Leverkusen, DE
• Rudolf Merten · Leverkusen, DE

Key dates

• Filing date: Dec 13, 1982
• Grant date: Jan 15, 1985
• Expiry date: Dec 13, 2002

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/28
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.