Patent · US Expired

Method and apparatus for fabricating a thermoelectric array

US4493939A · kind A · utility

76Cited by
19References
43Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 31, 1983
Grant dateJan 15, 1985
Priority date
Expiry dateOct 31, 2003

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49146

Abstract

A method and apparatus for fabricating a thermoelectric device includes forming a matrix board (12) with an array of orifices (100) formed therein. A plurality of P-type thermoelements (96) are formed and then a vacuum chuck (92) is utilized to dispose alternating ones of the elements (96) into the alternating ones of the orifices (100). A plurality of N-type elements (108) is formed and a vacuum chuck (104) is utilized to dispose alternating ones of the elements (108) into the remaining orifices (100) of the matrix (12). This forms an assembled array (52). A plurality of conductive tabs (114) is placed onto the P-type elements (98) and N-type elements (108) by a vacuum chuck (116). A second set of conductive tabs (120) is disposed on the opposite side of the assembled array by a vacuum chuck (124). A solder flow oven (54) and a solder flow oven (76) are utilized to reflow the solder on the tabs between the two operations. After connecting the tabs, the assembly (78) is moved to an epoxy station (80) to form an epoxy layer around the peripheral surfaces thereof to form a void (146) in the center portion thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.