Method and apparatus for fabricating a thermoelectric array
US4493939A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1983 |
| Grant date | Jan 15, 1985 |
| Priority date | — |
| Expiry date | Oct 31, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
Abstract
A method and apparatus for fabricating a thermoelectric device includes forming a matrix board (12) with an array of orifices (100) formed therein. A plurality of P-type thermoelements (96) are formed and then a vacuum chuck (92) is utilized to dispose alternating ones of the elements (96) into the alternating ones of the orifices (100). A plurality of N-type elements (108) is formed and a vacuum chuck (104) is utilized to dispose alternating ones of the elements (108) into the remaining orifices (100) of the matrix (12). This forms an assembled array (52). A plurality of conductive tabs (114) is placed onto the P-type elements (98) and N-type elements (108) by a vacuum chuck (116). A second set of conductive tabs (120) is disposed on the opposite side of the assembled array by a vacuum chuck (124). A solder flow oven (54) and a solder flow oven (76) are utilized to reflow the solder on the tabs between the two operations. After connecting the tabs, the assembly (78) is moved to an epoxy station (80) to form an epoxy layer around the peripheral surfaces thereof to form a void (146) in the center portion thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.