Patent · US Expired

Heat-removing circuit boards

US4495378A · kind A · utility

36Cited by

7References

6Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Richard Dotzer · Nuremberg, DE
Ernst-Friedrich Lechner · Erlangen, DE

Key dates

Filing date	Aug 22, 1983
Grant date	Jan 22, 1985
Priority date	—
Expiry date	Aug 22, 2003

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0315
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to circuit boards consisting of a flat core plate, 1 to 5 mm thick, of metallic material, graphite or electrically conductive carbon with a coating, 10 to 80 .mu.m thick, of electroplated aluminum eloxal and, optionally, an intermediate layer of copper or silver, 0.1 to 2 .mu.m thick. On the electroplated Al eloxal layer, a conductor run structure generated by an additive or subtractive technique may be present. The highly heat-conducting and mechanically strong circuit boards find application in electronics.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.