Metal-clad laminate construction
US4499152A · kind A · utility
32Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1983 |
| Grant date | Feb 12, 1985 |
| Priority date | — |
| Expiry date | Nov 7, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal-clad laminate having special utility in the production of high resolution printed circuit patterns and preparation of the laminate are described. The laminate preferably comprises a resin-bonded, glass-reinforced substrate, a layer of coupling agent covering and bonded to a major surface of the substrate, a layer of ultra-thin copper adjacent the layer of coupling agent, and a composite bonding layer disposed between the copper layer and the layer of coupling agent. The composite bonding layer comprises copper alloyed with at least one non-copper metal and oxide material of the non-copper metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.