Soldering mask formed from a photosensitive resin composition and a photosensitive element
US4499163A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1983 |
| Grant date | Feb 12, 1985 |
| Priority date | — |
| Expiry date | Jul 11, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G18/672
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.