Process for the production of an electronic component enclosed in a housing and apparatus for carrying out the process
US4499518A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 14, 1982 |
| Grant date | Feb 12, 1985 |
| Priority date | — |
| Expiry date | Dec 14, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for the production of an electronic component wherein electrical connections are soldered to the lateral sides of the component, after which the latter is introduced into a housing and a solidifiable resin is cast around the component in the housing. According to the invention, the connections are firstly produced in the form of a hairpin comprising two parallel branches interconnected via their first extremity, whereafter a convex part is formed on each branch towards their second extremities, so that after the second extremities are soldered to the lateral sides of the component, the distance between the convex parts and their position on each of the branches permits their insertion together with the component into the housing, the friction of the said convex parts against the inner sides of the housing being sufficient for holding together the housing and the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.