Method and apparatus for manufacturing a hot spot thermocouple
US4500031A · kind A · utility
5Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1982 |
| Grant date | Feb 19, 1985 |
| Priority date | — |
| Expiry date | Jun 1, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/01
Abstract
Method and apparatus for constructing a hot spot thermocouple includes setup and holding means for holding fine wires, a micrometer table with a microscope, welding and transfer fixtures attachable to the micrometer table for positioning the wires, and a welding device for welding and cutting the wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.