Apparatus for and method of controlling sputter coating
US4500408A · kind A · utility
57Cited by
24References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1983 |
| Grant date | Feb 19, 1985 |
| Priority date | — |
| Expiry date | Dec 27, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.