Enclosure for electronic components
US4500944A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1983 |
| Grant date | Feb 19, 1985 |
| Priority date | — |
| Expiry date | Jun 6, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure for electronic equipment includes an outer housing having an inner housing mounted therein. The inner housing has a fan and air deflector members mounted therein for maintaining a controlled circulation of air flow within the interior region of the inner housing so that air within the interior region is moved in heat exchange relationship with a heat sink member extending into the inner housing. The heat sink member in the inner housing is connected by thermal diodes with another heat sink member attached to a side wall of the outer housing. Another fan directs an air flow over the heat sink member attached to the side wall of the outer housing. A third fan is mounted within the interior region of the outer housing, but externally of the inner housing, for providing air circulation within the interior region of the outer housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.