Bondable polyamide
US4501883A · kind A · utility
3Cited by
5References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1983 |
| Grant date | Feb 26, 1985 |
| Priority date | — |
| Expiry date | Jul 15, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.