Substrate alignment and loading method for a powder reinforcing machine
US4503091A · kind A · utility
5Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1983 |
| Grant date | Mar 5, 1985 |
| Priority date | — |
| Expiry date | Dec 5, 2003 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA43D11/00
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The method of aligning and loading a substrate onto a powder reinforcement machine wherein a guide pin arrangement is adjusted with respect to settings on a portion of the machine frame and then adjusted distancewise from the machine frame, the guide pins themselves then adjusted with respect to the guide pin support, to facilitate alignment of substrates on the machine, the settings being repeatable for differently contoured substrates if desirable. The guide pin support being shiftable for removal from the path of a substrate transport cube, permitting rapid alignment of successive substrates of a particular configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.