Epoxy resin coating composition for printed circuit boards
US4504607A · kind A · utility
15Cited by
8References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 22, 1982 |
| Grant date | Mar 12, 1985 |
| Priority date | — |
| Expiry date | Jul 22, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.