Methods of aligning and mounting a plurality of electrical leads to a plurality of terminals
US4505035A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Apr 11, 1983 |
| Grant date | Mar 19, 1985 |
| Priority date | — |
| Expiry date | Apr 11, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A circuit board connector (14) is assembled to a printed wiring board (11) by first aligning a plurality of leads (18) by urging them into spaced guide grooves (49) of a workholder (41). The spacing of the guide grooves (49) corresponds to the spacing of terminals, also referred to as solder lands (19) on the printed wiring board (11). Within the guide grooves (49) the leads (18) are retained against a possible, lateral resilient stress while a deformable material, such as a solder, is formed across the leads and into spaces between the leads (18). The solder temporarily retains the spacing between the leads while the leads are removed from the workholder and become aligned with the lands (19). During the assembly of the connector (14) to the printed wiring board (11), the leads become resiliently deflected perpendicularly to the plane of the printed wiring board (11). The deflection generates a resilient force which frictionally urges the leads and the lands into contact with each other. The friction contact maintains the aligned position of the leads against any remaining lateral stresses within the leads (18) while the spacing solder is melted, reflows and solidifies to permanen…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.