Heating and cooling apparatus having evaporative cooler and heat pump
US4505327A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1981 |
| Grant date | Mar 19, 1985 |
| Priority date | — |
| Expiry date | Apr 9, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/54
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heating and cooling apparatus includes an evaporative cooler and a heat pump connected to each other and to a common duct system for utilizing the attributes of both systems for efficient heating and cooling. The evaporative cooler may be used to cool a structure directly or it may be used to cool the condenser coils of a heat pump. The evaporative cooler may also be used to cool attic space. The evaporative cooler and the heat pump are disposed adjacent to each other and are connected by an interface adapter, and the interface adapter is in turn connected to attic space through which air from the attic flows, particularly to assist the heat pump in the heating mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.