Patent · US Expired

Method of direct bonding copper foils to oxide-ceramic substrates

US4505418A · kind A · utility

39Cited by

3References

5Claims

0Family size

Assignee

Brown, Boveri & Cie AG · DE

Inventors

Arno Neidig · Plankstadt, DE
Dietmar Berndt · Lüdenscheid, DE
Georg Wahl · Rodenbach, DE
Mark Wittmer · Baden, CH

Key dates

Filing date	Dec 12, 1983
Grant date	Mar 19, 1985
Priority date	—
Expiry date	Dec 12, 2003

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/54
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Method for directly bonding copper foils having a copper oxide layer to oxide-ceramic substrates by heating the ceramic substrate covered with the copper foil in an oxygen-containing atmosphere to a temperature above the eutectic temperature of Cu and Cu.sub.2 O, but below the melting temperature of copper in a vacuum furnace at a pressure of not more than 1 mbar while maintaining a furnace atmosphere with a partial oxygen pressure between 0.001 and 0.1 mbar.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.