Soldering methods and devices
US4505421A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1981 |
| Grant date | Mar 19, 1985 |
| Priority date | — |
| Expiry date | Oct 5, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/723
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.