Bondable polyamide
US4505978A · kind A · utility
13Cited by
4References
54Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 28, 1982 |
| Grant date | Mar 19, 1985 |
| Priority date | — |
| Expiry date | Sep 28, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Self bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acids and one or two aliphatic dibasic acid having at least 6 carbon atoms and a monocarboxylic acid. These self bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g., a polyester, polyester-imide, or polyamide-imide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.