Copper body power hybrid package and method of manufacture
US4506108A · kind A · utility
73Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1983 |
| Grant date | Mar 19, 1985 |
| Priority date | — |
| Expiry date | Apr 1, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid microcircuit package especially for high power microcircuits comprises a hard copper base with integral packaged sidewalls, a sealing frame of Kovar or stainless steel is electron beam welded or laser welded to the top surface of said sidewalls, whereby to highly localize the high temperature at the wall tops and not anneal to the remainder of the copper base. A Kovar or stainless steel lid is conventionally sealed to the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.