Electro-magnetic alignment assemblies
US4507597A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1983 |
| Grant date | Mar 26, 1985 |
| Priority date | — |
| Expiry date | Jun 10, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2201/18
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention is directed to electromagnetic alignment apparatus, which is particularly adapted, among other possible uses, for use in aligning the wafers in a microlithography system, said apparatus comprising in combination a first magnetic circuit having a plurality of elements including a first magnet; a second magnetic circuit having a plurality of elements including a second magnet; the second magnetic circuit being disposed in spaced relationship with respect to the first magnetic circuit; a movable structural component adapted for mounting an object thereon; one element of each magnetic circuit being fixedly attached to the movable structural component; first and second current carrying coil assemblies mounted in the first magnetic circuit; the second coil assembly being disposed at an angle with respect to the first coil assembly; third and fourth current carrying coil assemblies mounted in the second magnetic circuit; the fourth coil assembly being disposed at an angle with respect to the third coil assembly; and control apparatus for controlling the flow and direction of the current through the coil assemblies, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.