Electronic components and system carrier assembly
US4507710A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 7, 1982 |
| Grant date | Mar 26, 1985 |
| Priority date | — |
| Expiry date | Jul 7, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an assembly of electronic components, including elemental electronic components, subassemblies or integrated circuits insertable into housings, and a system carrier having a surrounding injection-molded housing base of thermoplastic material, active zones of the electronic components and external electric terminals of the system carrier having electrical contacts connected by wires bonded thereto, the improvement therein including a web of thermoplastic material disposed between at least one of the contacts of the system carrier, on the one hand, and at least one of the contacts of the electronic components, on the other hand, and spacing the bonded wires away from the system carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.